• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A wafer holding system includes a wafer holding device (16) and a separation frame (14), the wafer holding device (16) having a bottom plate (26) and a top plate (28). The upper plate (28) includes a support surface (34) for holding the wafer (12), and the lower plate (26) has a maximum diameter (db) greater than the maximum diameter (dt) of the upper plate (28). is, so that the lower plate (26) comprises a receptacle (32) for the separating frame (14). The separation frame (14) has a plate-like shape forming a central opening (20), wherein the minimum diameter (ie) of the central opening (20) is greater than the maximum diameter (dt) of the upper plate (28), so that the Separation frame (14) to below the top of the wafer (12) and / or the support surface (34) decreases. Furthermore, a wafer holding device (16), a wafer holding system (18) and a mask aligner are provided.
    公开号:AT520469A2
    申请号:T50820/2018
    申请日:2018-09-25
    公开日:2019-04-15
    发明作者:
    申请人:Suss Microtec Lithography Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a wafer holding system, a wafer holding apparatus, a system comprising a wafer and a wafer holding apparatus, and a mask aligner having a mask holder and a wafer holding system.
    In the micro- and nano-fabrication of semiconductor devices or the like, very thin substrates such as wafers are used. The use of a dicing frame and a dicing tape for handling and dicing the thin substrates is known.
    Separating frames are rigid, plate-like structures with a central opening. The substrate or wafer is secured in the central opening using a release tape layer that spans at least portions of the central opening, preferably the entire central opening. Usually, the thickness of the separation frame itself is at least an order of magnitude greater than the thickness of the substrate. For example, the wafer has a thickness of 25 to 100 microns and the frame has a thickness of 1 to 2 mm.
    This difference in thickness causes problems in processing the substrate, especially in mask aligners, where only little or no gaps between a mask and the substrate are useful, for example in shadow imaging. As the mask approaches the substrate or wafer, which is typically held by a chuck, the mask comes into contact with the separation frame before the gap is small enough, i. before the desired size of the gap is reached.
    Thus, the object of the invention is to provide a wafer holding system, a wafer holding apparatus, a wafer and wafer holding apparatus, and a mask aligner in which little or no gaps are possible between a mask and the substrate, even if the substrate is in a separation frame is appropriate.
    For this purpose, there is provided a wafer holding system for holding a wafer with a wafer holding device and a separator frame, the wafer holding device having a lower plate and an upper plate arranged concentrically with each other, the upper plate comprising a support surface for holding the wafer holding the wafer from the lower plate surface facing away from the upper plate. The bottom plate has a maximum diameter greater than the maximum diameter of the top plate so that the bottom plate has a shoulder around the top plate that forms a receptacle for the separation frame. The separation frame has a plate-like shape that forms a central opening, wherein the minimum diameter of the central opening is greater than the maximum diameter of the upper plate, and the upper plate is adapted to extend through the central opening of the separation frame, so the separation frame is located in the receptacle, wherein the highest point of the separation frame in the vertical direction below the top of the wafer and / or the support surface, when the wafer is mounted in the separation frame and placed on top of the wafer holder. Thus, then the highest point of the system is the surface of the wafer, taking into account processing steps, particularly exposure steps, in which the mask should be in close proximity or in contact with the top of the wafer.
    In particular, the highest point of the separation frame is below the plane of the top of the wafer.
    The maximum diameter of the separation frame may be larger than the maximum diameter of the lower plate.
    The wafer is placed concentrically with the top plate on the top plate so that the dividing frame is not in contact with the top plate and may sink to the bottom plate.
    The object is further achieved by a wafer holding apparatus for holding a wafer mounted in a separation frame, having a bottom plate and a top plate arranged concentrically with each other, the top plate including a support surface for holding the wafer, that of the bottom plate opposite surface of the upper plate is. The lower plate has a maximum diameter which is greater than the maximum diameter of the upper plate so that the lower plate has a shoulder around the upper plate which forms a receptacle for the separation frame so that the separation frame lies in the receptacle highest point of the separation frame in the vertical direction below the top of the wafer and / or the support surface is when the wafer is mounted in the separation frame and placed on top of the wafer holder. The wafer holder may be a chuck. The fact that the shoulder and a receptacle are provided for the separation frame, the separation frame can sink completely below the height of the wafer, more precisely in the vertical direction below the height of the top of the wafer.
    The invention further relates to a system comprising a wafer and a wafer holding device having a lower plate and an upper plate arranged concentrically with each other, the upper plate comprising a support surface for holding the wafer, which faces away from the lower plate upper plate, wherein the support surface has the same dimensions as the wafer. The lower plate has a maximum diameter which is greater than the maximum diameter of the upper plate so that the lower plate has a shoulder around the upper plate which forms a receptacle for the separation frame so that the separation frame lies in the receptacle highest point of the separation frame in vertical
    Direction below the top of the wafer and / or the support surface is when the wafer is mounted in the separation frame and placed on top of the wafer holder.
    Preferably, the support surface has the same dimensions as the wafer. For example, with chucks of 200 mm, the diameter of the top plate is also 200 mm.
    Further contemplated in the invention is a system having a separation frame, a wafer mounted in the separation frame, and a wafer holding device, the wafer holding device having a bottom plate and a top plate arranged concentrically with each other. The top plate includes a support surface for holding the wafer, which is the surface of the top plate facing away from the bottom plate, wherein the support surface has the same dimensions as the wafer. The bottom plate has a maximum diameter greater than the maximum diameter of the top plate so that the bottom plate has a shoulder around the top plate that forms a receptacle for the separation frame. The separation frame has a plate-like shape that forms a central opening, and the separation frame is located above the support surface, wherein the minimum diameter of the central opening is greater than the maximum diameter of the upper plate. The wafer is located on the support surface and is mounted in the separation frame using divider tape and the top plate extends through the central opening of the divider frame so that the divider frame is in the receiver with the highest point of the divider frame in the vertical direction below the top of the wafer and / or the bearing surface is when the wafer is mounted in the separation frame and placed on top of the wafer holder.
    In particular, the lower plate and the upper plate may be fastened together. Thus, the lower plate and the upper plate may be separate elements that have been fastened together.
    The lower plate and / or the upper plate may be flat.
    For example, the maximum diameter of the lower plate is at least 1.3 times the maximum diameter of the upper plate to provide a stable and adequately sized receptacle.
    In one embodiment of the invention, the support surface is provided with at least one outer vacuum region and at least one inner vacuum region, the at least one outer vacuum region and the at least one inner vacuum region being fluidly separated from each other, the at least one outer vacuum region being located at the outer edge of the support surface. The vacuum areas may include grooves, porous surfaces or other suction devices. By providing an outer and an inner vacuum region, it is possible to securely fix the wafer to the substrate while avoiding bending the substrate in the middle. This can be achieved by activating both vacuum areas during installation and deactivating the inner vacuum area as soon as the wafer is securely fixed to the support surface.
    For example, the at least one outer vacuum region extends along at least three quarters of the circumference, in particular along the entire circumference of the upper plate. In this way, a secure fixation of the wafer can be ensured, even if only the outer vacuum area is actuated.
    In the radial direction, only an outer vacuum region may be provided to minimize bending.
    Preferably, the wafer holding device comprises a first supply line and a second supply line which are in fluid communication with the at least one outer vacuum region and the at least one inner vacuum region and terminate in a first vacuum opening and a second vacuum opening, respectively. The first supply line and the second supply line pass through the upper plate and the lower plate. Therefore, a vacuum can be applied to the vacuum areas with simple and reliable measures.
    The feed lines may extend radially outwardly in the lower plate, in particular in opposite directions, and towards the periphery of the lower plate.
    For example, a first vacuum opening and a second vacuum opening are provided on the periphery of the lower plate, with the first supply line and the second supply line terminating at the first vacuum opening and the second vacuum opening, respectively.
    There may be provided a plurality of internal vacuum regions which form concentric circles which are interconnected via radially extending webs to securely fix the wafer to the wafer support.
    In another embodiment, the top plate is made of a transparent material and the bottom plate is made of an opaque material, the bottom plate having at least one recess in the area covered by the top plate. Preferably, the lower plate has two opposite recesses for rear adjustment. The recess and the use of the transparent material allow the use of alignment marks on the underside of the wafer, which can serve for the optical adjustment of the wafer.
    To achieve long lifetimes and working cycles, the upper plate is made of glass and / or the lower plate of plastic or metal, especially steel or aluminum.
    There may be provided two recesses diametrically opposite to each other with respect to the top plate to allow different adjustment positions of the wafer.
    To avoid vibration or unwanted movement of the separation frame, the wafer holding device comprises at least one projection extending for aligning and / or supporting the separation frame from the shoulder of the lower plate on the same side as the upper plate.
    The projection may be a magnetic element for fixing the separation frame to the shoulder.
    A pre-orientation of the substrate on the platform can be effected via a notch, which can be provided in the outer periphery of the separation frame.
    The invention further provides a mask aligner for adjusting a mask and a wafer, comprising a mask holder and a wafer holding system according to the invention. As discussed above, the mask aligner may be for processing wafers mounted in a separation frame to expose the substrate or a coating thereon, with small gaps or even no gap present between the mask and the wafer ,
    In one embodiment of the invention, a short-range spacer and an actuator are provided on the mask holder. The actuator is configured to move the near range spacer between an active position and an inactive position, wherein the near range spacer is located radially outwardly of the region of the separation frame in the inactive position. Thus, the mask aligner can be used even if no near-range spacer is needed for this particular task.
    Other features and advantages of the invention will become apparent from the following description of the embodiments and the accompanying drawings, to which reference is made. 1 shows schematically a sectional view along the axis II of a system according to the invention with a wafer holding system according to the invention and a wafer holding device according to the invention, FIG. 2 shows a plan view of the system according to FIG. 1, FIG. 3 shows a part of an enlarged view of the plan view from FIG FIG. 4 shows a sectional view of the system from FIG. 1 along the axis IV-IV in FIG. 2, FIG. 5 shows schematically a second embodiment of the system according to the invention with a second embodiment of the wafer holding system and a second embodiment of the wafer holding device, FIG Mask aligner with a wafer holding system according to Figure 5, and - Figure 7, the mask aligner of Figure 6 with Nahbereichsabstandshaltern in another position.
    In Figures 1 and 2, a system 10 for holding a wafer 12 is shown. In FIG. 2, for the sake of simplicity, the wafer 12 and the separating strip are not shown.
    The wafer 12 may be a thin silicon wafer. For the purposes of the invention described, however, the term "wafer" may also include other substrates such as glass, 111 V materials, sapphire or the like.
    The wafer 12 may have standard sizes with a diameter dw of 125 mm, 150 mm, 200 mm or 300 mm.
    The system 10 includes a wafer 12, a separator frame 14, and a wafer holder 16. The separator frame 14 and the wafer holder 16 may be considered a wafer holding system 18.
    For the sake of clarity, wafer holder 16 is shown separate from wafer 12 and separator frame 14.
    The separation frame 14 is a rigid structure having a plate-like shape surrounding a central opening 20, as shown in FIG.
    The thickness of the separation frame 14 may be an order of magnitude greater than the thickness of the wafer 12.
    In the embodiment shown, the central opening 20 has a circular shape and a diameter, which in this case is also the minimum diameter, ie the central opening 20.
    For example, the outer contour of the separating frame 14 is not circular, but has a maximum diameter dF, max and a minimum diameter dF, min.
    The separation frame 14 further includes at least one notch 22 on its outer periphery.
    The wafer 12 is attached by means of separating tape 24 in the central opening 20 of the separating frame 14.
    The separating tape 24 is like a film and attached to the underside of the separating frame 14. It spans the central opening 20 partially or completely. The release belt 24 is flexible and may even be elastic.
    The wafer 12 is placed with its underside on the separating belt 24 within the central opening 20. In this way, the wafer 12 is mounted in the separation frame 14.
    The wafer holding device 16 has a lower plate 26 and an upper plate 28 which are fixed to each other.
    The wafer holder 16 may be a chuck, which may be mounted over the lower plate 26, for example, on a wedge error compensation head (not shown).
    The upper plate 28 is fixed to the top of the lower plate 26.
    Directional terms such as "upper", "lower", or the like are used with respect to the designated mounting position of the wafer 12 and the entire system 10. Thus, the upward direction is in the opposite direction as the direction of gravity.
    In the illustrated embodiment, the upper plate 28 and the lower plate 26 have a circular shape and are concentric with each other. It is of course possible that the lower plate 26 and the upper plate 28 have any other shape.
    The shape of the upper plate 28 corresponds exactly to the shape of the wafer 12; that is, the diameter dt of the upper plate 28 and the diameter dw of the wafer 12 are identical.
    Further, the diameter dt of the upper plate 28 is smaller than the minimum diameter, ie, the central opening 20, so that the upper plate 28 can pass through the central opening 20.
    Compared with the lower plate 26, the maximum diameter dt of the upper plate 28 is smaller than the maximum diameter db of the lower plate 26. The maximum diameter db of the lower plate 26 is, for example, at least 1.3 times the maximum diameter dt of the upper plate 28th
    In other words, the lower plate 26 is larger than the upper plate 28. Thus, the lower plate 26 extends radially further than the upper plate 28. The portion of the lower plate 26 that extends farther than the upper plate 28 forms a Shoulder 30 around the upper plate 28. The shoulder 30 is a receptacle 32 for the separation frame 14th
    The upper plate 28 has an upper side facing away from the lower plate 26. This surface is a bearing surface 34 for the wafer 12. The bearing surface 34 is shown enlarged in FIG.
    The support surface 34 includes vacuum means for generating a vacuum below the wafer 12 to fix the wafer 12 to the wafer holder 16 by suction.
    For this purpose, the bearing surface 34 has an inner vacuum region 36 and an outer vacuum region 38 with respect to the radial direction of the bearing surface 34.
    In FIG. 3, the inner vacuum region 36 and the outer vacuum region 38 are delimited by a dashed circle.
    The vacuum regions 36, 38 may be provided by vacuum grooves 40 in the support surface 34.
    It is also possible that the vacuum regions 36, 38 are provided by a porous surface portion of the support surface 34 or by other suction devices.
    In the embodiment shown, the outer vacuum region 38 completely surrounds the inner vacuum region 36 and the vacuum regions 36, 38 are fluidly separated from each other.
    The outer vacuum portion 38 contains the outer edge of the support surface and extends along the entire circumference of the upper plate 28th
    Furthermore, only one vacuum groove 40 in the outer vacuum region 38 is provided in the radial direction.
    The inner vacuum region 36 has a plurality of inner vacuum grooves 40 which form concentric circles which are interconnected by further vacuum grooves 40 forming radial spokes.
    The vacuum is supplied to the vacuum areas 36, 38, i. Air is drawn from the vacuum areas 36, 38 via a first supply line 42 and a second supply line 44.
    The first supply line 42 and the second supply line 44 are in fluid communication with the outer vacuum region 38 and the inner vacuum region 36, respectively.
    In the embodiment shown, the feed lines 42, 44 extend through the upper plate 28 into the lower plate 26.
    In the lower plate 26, the feed lines 42, 44 extend in opposite directions radially outward and toward the periphery of the lower plate 26.
    At the periphery of the lower plate 26, a first vacuum opening 46 and a second vacuum opening 48 are provided, wherein the first supply line 42 and the second supply line 44 terminate at the first vacuum opening 46 and the second vacuum opening 48, respectively.
    The vacuum ports 46, 48 are disposed diametrically opposite to each other at the periphery of the lower plate 26.
    The vacuum ports 46, 48 may be connected via tubing 50 or the like to a suitable vacuum source, not shown.
    In another embodiment, the vacuum ports 46, 48 may be disposed on the underside of the lower plate 26. In this case, the lower plate may be mounted on a larger platform having compatible openings for connection to the vacuum ports 46, 48, for example via O-rings.
    The upper plate 28 may be made of a transparent material such as glass and the lower plate 26 may be made of an opaque material such as plastic or metal, particularly steel or aluminum.
    In this embodiment, the lower plate 26 has two recesses below the upper plate 28, which extend through the entire thickness of the lower plate 26, as seen in Figure 4.
    The recesses 52 are diametrically opposed to each other with respect to the center of the lower plate 26.
    Furthermore, the recesses 52 may be located in a portion of the lower plate 26 that corresponds to a portion near the edge of the upper plate 28 below the upper plate 28.
    More specifically, this portion may extend from the edge of the top plate 28 about a quarter radially inward, more preferably about one sixth of the diameter dt of the top plate 28.
    Further, the lower plate 26 may include a projection 54 located at the top of the shoulder 30, i. on the same side as the top plate 28, is located. The projection 54 extends upwardly from the shoulder 30.
    In the embodiment shown in FIG. 1, the projection 54 is a dowel pin 56 intended to engage the notch 22 of the separation frame 14 when the separation frame 14 and the wafer 12 are attached to the wafer support system 18.
    For attaching the wafer 12 to the wafer support system 18, the separation frame 14 is placed with the wafer 12 above the wafer holder 16 so that the wafer 12 and the top plate 28 are concentric with each other. Then, the wafer 12 is lowered toward the wafer holding device 16. During the lowering of the separating frame 14, the wafer 12 - more precisely, the separating belt 24 - comes into contact with the bearing surface 34 of the upper plate 28.
    By applying a vacuum in both vacuum regions 36 and 38, this process is supported and the wafer 12 and separator tape 24 are fixed to the top plate 28.
    Once the wafer 12 is fixed on the support surface 34, the inner vacuum regions 36 may be deactivated so that the wafer 12 is not bent.
    The separation frame 14 is then above the shoulder 30 of the lower plate 26th
    In the embodiment shown, the maximum diameter dF, max of the separation frame 14 is smaller than the diameter db of the lower plate 26, so that the separation frame 14 is completely within the radial limits of the shoulder 30 and within the receptacle 32. In order for the separation frame 14 to be within the receptacle 32, it is not necessary for it to physically contact the shoulder 30.
    When the separation frame 14 is released from the end effector used for mounting, the separation frame 14 is held only by the separation band 24. However, the separation tape 24 is flexible so that it can not hold the weight of the separation frame 14. Thus, due to gravity, the separation frame 14 descends downward toward the lower plate 26.
    The separating frame 14 sinks downwards so far that its highest point lies below the plane P (FIG. 5) of the upper side of the wafer 12. The highest point of the system 10 is thus the surface of the wafer 12, whereby processing steps, in particular exposure steps, are taken into account, in which the mask should be in close proximity or in contact with the top of the wafer 12.
    FIG. 5 shows a second embodiment of the system 10. The second embodiment of the system 10 largely corresponds to the first embodiment shown in Figures 1 to 4. Therefore, only the differences will be explained below and the same or functionally identical parts are given the same reference numerals.
    In the second embodiment of the system 10 shown in FIG. 5, the wafer holding device 16 is made in one piece. The upper plate 28 and the lower plate 26 are made of the same material, in the case shown from an opaque material.
    Of course, it is also possible that a transparent material is used for the entire wafer holding device 16.
    Furthermore, the maximum diameter dF, max of the separation frame is greater than the maximum diameter db of the lower plate 26. Nevertheless, the separation frame 14 is located at least partially in the receptacle 32 above the shoulder 30 of the lower plate 26th
    Further, the protrusion 54 is a magnetic member that fixes the separation frame 14 to the shoulder 30 by magnetic force. In this way, unwanted vibrations of the separation frame 14 can be eliminated.
    The fixation can be done by direct contact between the separation frame 14 and the projection 54 or solely by magnetic forces without contact.
    FIGS. 6 and 7 show schematic sectional views of a mask aligner 58.
    The mask aligner 58 comprises a mask holder 60 and a mask 62 and the system 10 with the wafer 12, the separating frame 14 and the wafer holding device 16.
    The mask holder 60 is a rigid structure having an exposure opening 64 covered by the mask 62. The mask 62 is fixed to the underside of the mask holder 60, for example by vacuum, and partially or completely closes the exposure opening 64.
    Further, the mask holder 60 of the illustrated example includes at least three short-range spacers 66 and at least three actuators 68 for moving each short-range spacer 66.
    The short-range spacers 66 are ceramic balls, for example, with a diameter of 2,000 μm.
    The proximity spacers 66 are held by support arms 70 that extend parallel to the exposure opening 64.
    The support arms 70 are attached to rods 72 which are rotatably mounted on the mask holder 60.
    The rods 72 may be rotated with respect to their vertical axis by the actuators 68 to move the proximity spacers 66 between an active position and an inactive position.
    In FIG. 6, the proximity spacers 66 are shown in their inactive position in which they lie radially outside the region of the separation frame 14. In this way, when the mask 62 and the wafer 12 are to contact each other for exposure, the near-area spacers 66 do not come into contact with the separation frame 14.
    In Figure 7, the proximity spacers 66 are shown in their active position. In the active position, the short-range spacers 66 are radially within the area of the upper plate 28 and the wafer 12.
    The mask 62 and the mask holder 60 may then be lowered until both the wafer 12 and the mask 62 contact the proximity spacers 66 from opposite sides. In this way, a predetermined gap can be achieved between the mask 62 and the wafer 12.
    The features of the embodiments shown may, of course, be used in combinations other than those shown in the embodiments. For example, the projections 54 in the first embodiment may also be magnetic elements.
    权利要求:
    Claims (13)
    [1]
    A wafer holding system for holding a wafer (12) having a wafer holding device (16) and a separating frame (14), said wafer holding device (16) having a lower plate (26) and an upper plate (28) concentric with each other, the upper plate (28) including a support surface (34) for holding the wafer (12) which is the surface of the upper plate (28) remote from the lower plate (26), the lower plate (26) having a maximum diameter (db) greater than the maximum diameter (dt) of the top plate (28) such that the bottom plate (26) has a shoulder (30) around the top plate (28) having a receptacle (32) therein. for the separation frame (14), the separation frame (14) having a plate-like shape forming a central opening (20), the minimum diameter (ie) of the central opening (20) being greater than the maximum diameter (dt) of the upper plate (28), wherein the upper plate (28) is designed so that it can extend through the central opening (20) of the separating frame (14) so that the separating frame (14) lies in the receptacle (32), the highest point of the separating frame (14) being vertically below the upper side of the wafer (12 ) and / or the support surface (34) when the wafer (12) is mounted in the separation frame (14) and placed on top of the wafer holder (16).
    [2]
    A wafer holding apparatus for holding a wafer (12) mounted in a separation frame (14), having a bottom plate (26) and a top plate (28) concentric with each other, the top plate (28) having a support surface (34 ) for holding the wafer (12) which is the surface of the top plate (28) remote from the bottom plate (26), the bottom plate (26) having a maximum diameter (db) greater than the maximum diameter (dt) of the upper plate (28) so that the lower plate (26) has a shoulder (30) around the upper plate (28) which forms a receptacle (32) for the separation frame (14) so that the separation frame (14) in the receptacle (32), wherein the highest point of the separation frame (14) in the vertical direction below the top of the wafer (12) and / or the support surface (34), when the wafer (12) in the separation frame ( 14) and placed on top of the wafer holder (16).
    [3]
    A system comprising a wafer (12) and a wafer holder (16) having a bottom plate (26) and a top plate (28) concentric with each other, the top plate (28) having a support surface (34). for holding the wafer (12) which is the surface of the top plate (28) remote from the bottom plate (26), the bottom plate (26) having a maximum diameter (db) greater than the maximum diameter (db). dt) of the upper plate (28), so that the lower plate (26) has a shoulder (30) around the upper plate (28) around which forms a receptacle (32) for a separation frame (14), so that the separation frame ( 14) lies vertically below the top of the wafer (12) and / or the support surface (34) when the wafer (12) is mounted in the separation frame (14) and placed on top of the wafer holder (16).
    [4]
    The wafer holding system of claim 1, the wafer holding device of claim 2 or the system of claim 3, wherein the support surface (34) has the same dimensions as the wafer (12).
    [5]
    5. wafer holding system according to claim 1 or 4, wafer holding device according to claim 2 or 4 or system according to claim 3 or 4, characterized in that the maximum diameter (db) of the lower plate (26) at least 1.3 times the maximum diameter ( dt) of the upper plate (28) is.
    [6]
    6. wafer holding system according to any one of claims 1, 4 and 5, wafer holding device according to any one of claims 2, 4 and 5 or system according to one of claims 3 to 5, characterized in that the bearing surface (34) with at least one outer vacuum region (38). and at least one inner vacuum region (36), said at least one outer vacuum region (38) and said at least one inner vacuum region (36) being fluidly separated from one another, said at least one outer vacuum region (38) being formed at the outer edge of said bearing surface (34). is located.
    [7]
    7. Wafer holding system, wafer holding device or system according to claim 6, characterized in that the at least one outer vacuum region (38) extends along at least three quarters of the circumference, in particular along the entire circumference of the upper plate (28).
    [8]
    8. Wafer holding system, wafer holding device or system according to claim 6 or 7, characterized in that the wafer holding device (16) comprises a first supply line (42) and a second supply line (44) with the at least one outer vacuum region (38) and the at least one inner vacuum portion (36) are in fluid communication and terminate in a first vacuum port (46) and a second vacuum port (48), respectively, wherein the first supply line (42) and the second supply line (44) pass through the lower plate (26).
    [9]
    9. Wafer holding system according to one of claims 1 and 4 to 8, wafer holding device according to one of claims 2 and 4 to 8 or system according to one of claims 3 to 8, characterized in that the upper plate (28) made of a transparent material and the lower Plate (26) consists of an opaque material, wherein the lower plate (26) has at least one recess (52) in the area covered by the upper plate (28).
    [10]
    10. Wafer holding system, wafer holding device or system according to claim 9, characterized in that the upper plate (28) consists of glass and / or that the lower plate (26) made of plastic or metal, in particular steel or aluminum.
    [11]
    11. The wafer holding system according to claim 1, wherein the wafer holding device comprises at least one projection, which extends to align and / or support the separation frame (14) from the shoulder (30) of the lower plate (26) on the same side as the upper plate (28).
    [12]
    12. mask aligner for adjusting a mask (62) and a wafer (12), with a mask holder (60) and a wafer holding system (18) according to any one of claims 1 and 4 to 11 or a system (10) according to any one of claims 3 to 11th
    [13]
    13. A mask aligner according to claim 12, characterized in that on the mask holder (60) at least one Nahbereichsabstandshalter (66) and an actuator (68) are provided, wherein the actuator (68) is formed so that it the Nahbereichsabstandshalter (66) between an active position and an inactive position, wherein the Nahbereichsabstandshalter (66) is located in the inactive position radially outward of the region of the separating frame (14).
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    同族专利:
    公开号 | 公开日
    SG10201808377WA|2019-04-29|
    AT520469A3|2021-04-15|
    US20190096733A1|2019-03-28|
    CN109560033A|2019-04-02|
    NL2019623B1|2019-04-01|
    KR20190035570A|2019-04-03|
    DE102018122449A1|2019-03-28|
    TW201916245A|2019-04-16|
    AT520469B1|2021-11-15|
    JP2019062201A|2019-04-18|
    US10937681B2|2021-03-02|
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    法律状态:
    优先权:
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    NL2019623A|NL2019623B1|2017-09-25|2017-09-25|Wafer support system, wafer support device, system comprising a wafer and a wafer support device as well as mask aligner|
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